YOKOWO has developed LTCC (Low Temperature Co-fired Ceramics) CSP substrates with high heat dissipation and high reflectivity, with thicknesses ranging from 0.075 to 0.150 mm. They are mainly used for LED package applications. Electrode materials Silver (Ag) conductor is used. Under normal circumstances, high-brightness LED only 25% of the energy into light, the remaining energy will become heat. An inner plate of the LTCC substrate is provided with heatsinks, and thousands of tiny CSPs are arranged together. The CSPs and the front and back vias are pad bonded to at least one of the front surface and the back surface. The higher the temperature the lower the luminous efficiency of LED, so users strongly demand to improve the package of heat dissipation. Therefore, in high-current LEDs, there are more and more package substrates using alumina substrates and aluminum nitride ceramic substrates in consideration of heat dissipation characteristics. However, due to the low reflectivity and dimensional accuracy of the alumina substrate, there is a lack of reliability in packaging LED chips. In addition, there is a problem that the price of the aluminum nitride substrate is very high. As a result, we develop LTCC substrates that have high heat dissipation characteristics, support miniaturization and thinning, and help to reduce costs. The outer periphery of the LTCC substrate is configured with an "outer frame" slightly thicker than the CSP portion in an integrated manner, thereby improving the processing capability when packaging the chip. In addition, the self-developed process is also adopted, which greatly improves the bonding strength between the substrate and the equipped LED chip. Size error of ± 0.15% or less. Surface treatment is performed by nickel-gold electroplating (Ni-Au). The development of the package substrate is currently LED package manufacturers for sample evaluation. It is planned to be manufactured at the "Cutting Edge Devices Center" (TomonÅ, Gunma Prefecture), a development and production base of LTCC. The new facility under construction at the center, which has a gross floor area of ​​about 500m2, is scheduled to be completed by the end of May 2015, and the company will arrange workshops in the new factory. According to reports, will build 500,000 monthly production size of 50mm square LTCC assembly substrate, each substrate is arranged with thousands of size 1.0 × 1.0 × 0.15mm CSP. It is scheduled to start mass production after October 2015. Aluminium Parts For Construction Aluminium Parts For Construction,Aluminium Construction Parts,Construction Aluminium Profile,Automotive Construction Parts KAM KIU ALUMINIUM GROUP , https://www.kamkiualuminium.com